Module 4 : Chemical and non–chemical approach to materials synthesis - part 2

Lecture 25 : Sputtering Processes for Thin Film Deposition

Magnetron Sputter Deposition

Use with DC or RF

High sputtering efficiency increase ionization of Ar

  • Why? Higher sputter rates at lower Ar pressures (down to 0.5 mTorr)
    fewer gas collisions - more line of sight
  • How ? increase probability of electrons striking Ar
    • increase electron path length
    • use electric and magnetic fields