Sputter Yield
Sputtering process is characterized by sputter yield (S)
S values are typically in the range of 0.01 and 4 and increase with the mass of metals and energy of the sputtering gas.
Module 4 : Chemical and non–chemical approach to materials synthesis - part 2
Lecture 25 : Sputtering Processes for Thin Film Deposition
Sputter Yield
Sputtering process is characterized by sputter yield (S)
S values are typically in the range of 0.01 and 4 and increase with the mass of metals and energy of the sputtering gas.