Module 5 : Power Disipation in CMOS Circuits
Lecture 26 : Power Disipation in CMOS Circuits
 
26.3 How To Reduce Temperature
The heat generated due to power dissipation can be taken away by the use of heat sinks. A heat sink has lower thermal resistance than the package and hence draws heat from it. For the heat to be effectively removed, the rate of heat transfer from the area of heat generation to the ambient should be greater than the rate of heat generation. This rate of heat transfer depends on the thermal resistance.
 
The thermal resistance, theta is given by the following relation:
thetaeq
(Eq 26.2)
where,  

l = length,

A = Area and

sigmac = thermal conductivity of the heat sink

From the above relation it can be seen that large sigmac implies smaller theta .
theta is also given by the relation,
dtdp
(Eq 26.3)
Using this relation, we can see that for a given power dissipation, Pd
thetalessthan
(Eq 26.4)
where,
Tj = junction temperature, and
Ta = ambient temperature.
 
Heat sink materials are generally coated black to radiate more energy
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
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