| 1 | Glimpses of Microsystems: Scaling Effects | PDF unavailable |
| 2 | Smart Materials and Systems | PDF unavailable |
| 3 | Microsensors | PDF unavailable |
| 4 | Microactuators | PDF unavailable |
| 5 | Microsystems: some Examples | PDF unavailable |
| 6 | Smart systems Application and Structural Health Monitoring | PDF unavailable |
| 7 | Microfabrication Technologies | PDF unavailable |
| 8 | Thin-film Materials and their Deposition | PDF unavailable |
| 9 | Approaches for Pattern Transfer | PDF unavailable |
| 10 | Surface Micromachining of Microstructures | PDF unavailable |
| 11 | Bulk Micromachining of Microsystems | PDF unavailable |
| 12 | Extended Approaches for Working Microsystems | PDF unavailable |
| 13 | Non-conventional Approaches for Microsystems | PDF unavailable |
| 14 | Packaging of Microsystems | PDF unavailable |
| 15 | Deformation Strains and Stresses | PDF unavailable |
| 16 | Microdevice Suspensions: Lumped Modeling | PDF unavailable |
| 17 | Residual Stress and Stress Gradients | PDF unavailable |
| 18 | Torsion and Twist | PDF unavailable |
| 19 | Vibrations of Microsystems Devices: Part -1 | PDF unavailable |
| 20 | Vibrations of Microsystems Devices: Part -2 Micromachined Gyroscopes: Part -1 | PDF unavailable |
| 21 | Micromachined Gyroscopes: Part -2 Modelling of Coupled Electrostatic Microsystems: Part -1 | PDF unavailable |
| 22 | Modelling of Coupled Electrostatic Microsystems: Part -2 | PDF unavailable |
| 23 | Coupled Electrothermal-elastic Modelling | PDF unavailable |
| 24 | Modelling of Microsystems: Scaling Effects | PDF unavailable |
| 25 | Finite Element Method and Microsystems | PDF unavailable |
| 26 | Theoretical Basis for the Finite Element Method | PDF unavailable |
| 27 | Energy Theorems and Weak Form of the Governing Equation | PDF unavailable |
| 28 | Finite Element Equation Development and Shape Functions | PDF unavailable |
| 29 | Isoparametric FE Formulation and some Examples | PDF unavailable |
| 30 | Finite Element for Structures with Piezoelectric Material | PDF unavailable |
| 31 | Semiconductor Device Physics | PDF unavailable |
| 32 | BJT and MOSFET Characteristics and Op-Amps | PDF unavailable |
| 33 | Op-Amp Circuits and Signal conditioning for Microsystems Devices | PDF unavailable |
| 34 | Control and Microsystems | PDF unavailable |
| 35 | Vibration Control of a Beam | PDF unavailable |
| 36 | Signal Conditioning Circuits and Integration of Microsystems and Microelectronics | PDF unavailable |
| 37 | Pressure Sensor Design Concepts, Processing, and Packaging: Part -1 | PDF unavailable |
| 38 | Pressure Sensor Design Concepts, Processing, and Packaging: Part -2 | PDF unavailable |
| 39 | Pressure Sensor Design Concepts, Processing, and Packaging: Part -3 Capacitive Micro-accelerometer: Part -1 | PDF unavailable |
| 40 | Capacitive Micro-accelerometer: Part -2 | PDF unavailable |