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Chemical Engineering
Introduction to Microelectronic Fabrication Processes (Web)
Syllabus
Co-ordinated by :
IIT Madras
Available from :
2012-07-11
Lec :
1
Modules / Lectures
Introduction
Lecture 1: Introduction
Lithography
Lecture 2: Lithography- Layout and Mask
Lecture 3: Lithography- Basic process
Lecture 4: Lithography- Basic process (continued)
Lecture 5: : Advanced lithography
Lecture 6: : Advanced lithography-II
Lecture 7: Lithography-production details, next generation lithography
Depostion Techniques
Lecture 8: : Physical Vapor Deposition
Lecture 9: : Physical Vapor Deposition - continued
Lecture 10: : Physical Vapor Deposition and Chemical Vapor Deposition
Lecture 11: Chemical Vapor Deposition - continued
Lecture 12: Chemical Vapor Deposition, Electrochemical Deposition, Spin-on coating
Removal Techniques
Lecture 13: Wet etching
Lecture 14: Dry etching
Lecture 15: Dry etching Continued
Lecture 16: Chemical Mechanical Planarization (CMP)
Lecture 17: CMP continued
FEOL
Lecture 18: Band Structure
Lecture 19: Diodes
Lecture 20: MOS transistor structure and operation
Lecture 21: MOS transistor (continued)
Lecture 22: MOS transistor Processing
Lecture 23: MOS transistor fabrication and isolation
Diffusion
Lecture 24: Diffusion basics & Constant source diffusion
Lecture 25: Limited source diffusion
Lecture 26: Diffusion- production issues
Ion Implantation
Lecture 27: Ion implantation - basics
Lecture 28: Ion implantation – non idealities
Oxidation
Lecture 29: Oxidation - basics
Lecture 30: Oxidation - Modeling
Process Integration
Lecture 31: BEOL issues and Aluminum metallization
Lecture 32: Electromigration and copper metallization
Testing
Lecture 33: Testing Basics
Lecture 34: FBM
Yield
Lecture 35: Yield and defects - basics
Lecture 36: Yield models and data analysis
Lecture 37: Yield analysis
Lecture 38: Yield analysis - continued
Tools and Techniques
Lecture 39: Scanning electron microscopy
Lecture 40: SEM (continued) and atomic force microscopy
Lecture 41: AFM (Continued) and Ellipsometry
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