Chapter 3   : Fabrication of CMOS Integrated Circuits

 


The last part of kinetics in an evaporation process is the deposition onto substrate and the film thickness (d) depends on r, , through dM/dAs .

Consider flat substrate perpendicular to source as shown in Fig. 3.25,

 



Fig. 3.25 : The deposition of evaporant to a flat surface perpendicular to source