Course Name: Electronics Enclosures Thermal Issues

Course abstract

Electronics Design is understood as analysis and implementation at various levels from large systems installation to chip design. One of the aspects is failure due to temperature effects is constantly under study. Theory of Heat transfer has been understood and explained way back in 1700. Rigor and precision has resulted in seemingly complicated ‘equations’. In the design of enclosures, managing heat is (relatively) well understood. Empirical results can be used to optimise the layout and reduce failure. Practices in use of heat management hardware are available from specialist manufacturers and can be used. This course is an attempt to familiarise the participating registrants with heat related issues in Design of Electronic Product enclosures.


Course Instructor

Media Object

Prof. N V Chalapathi

NV Chalapathi Rao is a B.E. in Mechanical Engineering (1972) from Andhra University, Waltair. He was Worked in Bharat Electronics Ltd for 10 years designing electronics products for defense.He has a PGDM (MBA) 78-80 from IIM Bangalore.He has been teaching Design of Electronics Products and guiding Product Design projects at the Centre for Electronics Design and Technology (CEDT), Department of Electronics Systems Engineering (DESE) since 1984.He was one of the core faculty of Centre for Product Design and Manufacturing (CPDM) at the time of inception. And taught Product Planning and Management.He continues to advise students at DESE.


Teaching Assistant(s)

No teaching assistant data available for this course yet
 Course Duration : Feb-Mar 2018
  View Course
 Syllabus
 Enrollment : 20-Nov-2017 to 05-Feb-2018
 Exam registration : 08-Jan-2018 to 07-Mar-2018
 Exam Date : 28-Apr-2018, 29-Apr-2018

Enrolled

1088

Registered

91

Certificate Eligible

84

Certified Category Count

Gold

0

Elite

59

Successfully completed

25

Participation

3

Success

Elite

Gold




Legend

>=90 - Elite + Gold
60-89 - Elite
40-59 - Successfully Completed
<40 - No Certificate

Final Score Calculation Logic

  • Assignment Score = Average of best 6 out of 8 assignments.
  • Final Score(Score on Certificate)= 75% of Exam Score + 25% of Assignment Score
Electronics Enclosures Thermal Issues - Toppers list

GUDIVADA SAI MEGHANA 79%

ANDHRA UNIVERSITY COLLEGE OF ENGINEERING FOR WOMEN

AMAN ADITYA 77%

SRM INSTITUTE OF SCIENCE AND TECHNOLOGY (DELHI-NCR CAMPUS)

ABHIVIRAJ PILLAI 75%

SRM UNIVERSITY - RAMAPURAM

NAREDLA NAGA VENKATA ANJANI 75%

ANDHRA UNIVERSITY COLLEGE OF ENGINEERING FOR WOMEN

NANDHINI.S 74%

PSG COLLEGE OF TECHNOLOGY

KONDAPALLI KUSUMA KUMARI 74%

ANDHRA UNIVERSITY COLLEGE OF ENGINEERING FOR WOMEN

SACHIN HATTIYAVAR 74%

GOGTE INSTITUTE OF TECHNOLOGY

Enrollment Statistics

Total Enrollment: 1088

Registration Statistics

Total Registration : 91

Assignment Statistics



Assignment

Exam score

Final score

Score Distribution Graph - Legend

Assignment Score: Distribution of average scores garnered by students per assignment.
Exam Score : Distribution of the final exam score of students.
Final Score : Distribution of the combined score of assignments and final exam, based on the score logic.