| Module Name | Download | Description | Download Size |
|---|---|---|---|
| WEEK 1 | noc22-me61_week1 | ||
| WEEK 2 | noc22-me61_week2 | ||
| WEEK 3 | noc22-me61_week3 | ||
| WEEK 4 | noc22_me61_week 4 |
| Sl.No | Chapter Name | MP4 Download |
|---|---|---|
| 1 | Lecture 1 : Introduction-1 | Download |
| 2 | Lecture 2 : Introduction-2 | Download |
| 3 | Lecture 3 : Introduction-3 | Download |
| 4 | Lecture 4 : Semiconductors and Components-1 | Download |
| 5 | Lecture 5 : Semiconductors and Components-2 | Download |
| 6 | Lecture 06: 1st Level Packaging- I | Download |
| 7 | Lecture 07: 1st Level Packaging- II | Download |
| 8 | Lecture 08: Area Array Packages- I | Download |
| 9 | Lecture 09: Area Array Packages- II | Download |
| 10 | Lecture 10: Area Array Packages- III | Download |
| 11 | Lecture 11 : Flip Chip Technology | Download |
| 12 | Lecture 12 : 1st Level Interconnections- I | Download |
| 13 | Lecture 13 : 1st Level Interconnections- II | Download |
| 14 | Lecture 14 : 1st Level Interconnections- III | Download |
| 15 | Lecture 15 : Advanced Packaging | Download |
| 16 | Lecture 16: 2nd Level Packaging: PCB- I | Download |
| 17 | Lecture 17: 2nd Level Packaging: PCB- II | Download |
| 18 | Lecture 18: 2nd Level Packaging: PCB- III | Download |
| 19 | Lecture 19: 2nd Level Packaging: PCB- IV | Download |
| 20 | Lecture 20: 2nd Level Packaging: PCB- V | Download |
| 21 | Lecture 21: System Integration | Download |
| 22 | Lecture 22: Thermal Management 1: Introduction | Download |
| 23 | Lecture 23: Thermal Management 2: Concepts | Download |
| 24 | Lecture 24: Thermal Management 3: Thermal Resistance | Download |
| 25 | Lecture 25: Thermal Management 4: Heat Sink | Download |
| 26 | Lecture 26 : Thermal Management 5: Heat Sink Characterization | Download |
| 27 | Lecture 27 : Thermal Management 6: Heat Transfer Correlations | Download |
| 28 | Lecture 28 : Thermal Management 7: Practice Problems | Download |
| 29 | Lecture 29 : Thermal Mangement 8: Thermal Technologies | Download |
| 30 | Lecture 30 : Thermal Management 9: Novel Cooling Technologies | Download |
| 31 | Lecture 31: Shock and Vibration -1 | Download |
| 32 | Lecture 32: Shock and Vibration -2 | Download |
| 33 | Lecture 33: Shock and Vibration -3 | Download |
| 34 | Lecture 34: Shock and Vibration -4 | Download |
| 35 | Lecture 35: Electronic Packaging Reliability -1 | Download |
| 36 | Lecture 36: Electronic Packaging Reliability -2 | Download |
| 37 | Lecture 37: Electronic Packaging Reliability -3 | Download |
| 38 | Lecture 38: Electronic Packaging Reliability -4 | Download |
| 39 | Lecture 39: Power Electronics Packaging | Download |
| 40 | Lecture 40: Special Topics | Download |
| Sl.No | Chapter Name | English |
|---|---|---|
| 1 | Lecture 1 : Introduction-1 | Download To be verified |
| 2 | Lecture 2 : Introduction-2 | Download To be verified |
| 3 | Lecture 3 : Introduction-3 | Download To be verified |
| 4 | Lecture 4 : Semiconductors and Components-1 | Download To be verified |
| 5 | Lecture 5 : Semiconductors and Components-2 | Download To be verified |
| 6 | Lecture 06: 1st Level Packaging- I | Download To be verified |
| 7 | Lecture 07: 1st Level Packaging- II | Download To be verified |
| 8 | Lecture 08: Area Array Packages- I | Download To be verified |
| 9 | Lecture 09: Area Array Packages- II | Download To be verified |
| 10 | Lecture 10: Area Array Packages- III | Download To be verified |
| 11 | Lecture 11 : Flip Chip Technology | Download To be verified |
| 12 | Lecture 12 : 1st Level Interconnections- I | Download To be verified |
| 13 | Lecture 13 : 1st Level Interconnections- II | Download To be verified |
| 14 | Lecture 14 : 1st Level Interconnections- III | Download To be verified |
| 15 | Lecture 15 : Advanced Packaging | Download To be verified |
| 16 | Lecture 16: 2nd Level Packaging: PCB- I | Download To be verified |
| 17 | Lecture 17: 2nd Level Packaging: PCB- II | Download To be verified |
| 18 | Lecture 18: 2nd Level Packaging: PCB- III | Download To be verified |
| 19 | Lecture 19: 2nd Level Packaging: PCB- IV | Download To be verified |
| 20 | Lecture 20: 2nd Level Packaging: PCB- V | Download To be verified |
| 21 | Lecture 21: System Integration | Download To be verified |
| 22 | Lecture 22: Thermal Management 1: Introduction | Download To be verified |
| 23 | Lecture 23: Thermal Management 2: Concepts | Download To be verified |
| 24 | Lecture 24: Thermal Management 3: Thermal Resistance | Download To be verified |
| 25 | Lecture 25: Thermal Management 4: Heat Sink | Download To be verified |
| 26 | Lecture 26 : Thermal Management 5: Heat Sink Characterization | Download To be verified |
| 27 | Lecture 27 : Thermal Management 6: Heat Transfer Correlations | Download To be verified |
| 28 | Lecture 28 : Thermal Management 7: Practice Problems | Download To be verified |
| 29 | Lecture 29 : Thermal Mangement 8: Thermal Technologies | Download To be verified |
| 30 | Lecture 30 : Thermal Management 9: Novel Cooling Technologies | Download To be verified |
| 31 | Lecture 31: Shock and Vibration -1 | Download To be verified |
| 32 | Lecture 32: Shock and Vibration -2 | Download To be verified |
| 33 | Lecture 33: Shock and Vibration -3 | Download To be verified |
| 34 | Lecture 34: Shock and Vibration -4 | Download To be verified |
| 35 | Lecture 35: Electronic Packaging Reliability -1 | Download To be verified |
| 36 | Lecture 36: Electronic Packaging Reliability -2 | Download To be verified |
| 37 | Lecture 37: Electronic Packaging Reliability -3 | Download To be verified |
| 38 | Lecture 38: Electronic Packaging Reliability -4 | Download To be verified |
| 39 | Lecture 39: Power Electronics Packaging | Download To be verified |
| 40 | Lecture 40: Special Topics | Download To be verified |
| Sl.No | Language | Book link |
|---|---|---|
| 1 | English | Not Available |
| 2 | Bengali | Not Available |
| 3 | Gujarati | Not Available |
| 4 | Hindi | Not Available |
| 5 | Kannada | Not Available |
| 6 | Malayalam | Not Available |
| 7 | Marathi | Not Available |
| 8 | Tamil | Not Available |
| 9 | Telugu | Not Available |