| Name | Download | Download Size |
|---|---|---|
| Lecture Note | Download as zip file | 122M |
| Module Name | Download | Description | Download Size |
|---|---|---|---|
| CAD for Printed Wiring Boards | Test 1 mid-course (Test covers Modules 1-5) | Test 1 mid-course (Test covers Modules 1-5). This is a timed-test for 1 hr, complete the test and get back to the instructor for any queries. | 172 |
| Surface Mount Technology | Test 2 mid-course (Test covers Modules 6 and 7) | Test 2 mid-course (Test covers Modules 6 and 7). This is a timed-test for 1 hr, complete the test and get back to the instructor for any queries. | 48 |
| Conclusion and Summary | Final Exam (Examination covers all modules) | Final Exam (Examination covers all modules). This is a timed-test for 3 hrs, complete the test and get back to the instructor for any queries. | 543 |
| Sl.No | Chapter Name | English |
|---|---|---|
| 1 | Introduction and Objectives of the course | Download Verified |
| 2 | Definition of a system and history of semiconductors | Download Verified |
| 3 | Products and levels of packaging | Download Verified |
| 4 | Packaging aspects of handheld products; Case studies in applications | Download Verified |
| 5 | Case Study (continued); Definition of PWB, summary and Questions for review | Download Verified |
| 6 | Basics of Semiconductor and Process flowchart; Video on Sand-to-Silicon | Download Verified |
| 7 | Wafer fabrication, inspection and testing | Download Verified |
| 8 | Wafer packaging; Packaging evolution; Chip connection choices | Download Verified |
| 9 | Wire bonding, TAB and flipchip-1 | Download Verified |
| 10 | Wire bonding, TAB and flipchip-2; Tutorials | Download Verified |
| 11 | Why packaging? & Single chip packages or modules (SCM) | Download Verified |
| 12 | Commonly used packages and advanced packages; Materials in packages | Download Verified |
| 13 | Advances packages (continued); Thermal mismatch in packages; Current trends in packaging | Download Verified |
| 14 | Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages | Download Verified |
| 15 | Electrical Issues : I; Resistive Parasitic | Download Verified |
| 16 | Electrical Issues : II; Capacitive and Inductive Parasitic | Download Verified |
| 17 | Electrical Issues : III; Layout guidelines and the Reflection problem | Download Verified |
| 18 | Electrical Issues : IV; Interconnection | Download Verified |
| 19 | Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT | Download Verified |
| 20 | Components of a CAD package and its highlights | Download Verified |
| 21 | Design Flow considerations; Beginning a circuit design with schematic work and component layout | Download Verified |
| 22 | Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability | Download Verified |
| 23 | Review of CAD output files for PCB fabrication; Photo plotting and mask generation | Download Verified |
| 24 | Process flow-chart; Vias; PWB substrates | Download Verified |
| 25 | Substrates continued; Video highlights; Surface preparation | Download Verified |
| 26 | Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs | Download Verified |
| 27 | PWB etching; Resist stripping; Screen-printing technology | Download Verified |
| 28 | Through-hole manufacture process steps; Panel and pattern plating methods | Download Verified |
| 29 | Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias | Download Verified |
| 30 | Microvia technology and Sequential build-up technology process flow for high-density interconnects | Download Verified |
| 31 | Conventional Vs HDI technologies; Flexible circuits; Tutorial session | Download Verified |
| 32 | SMD benefits; Design issues; Introduction to soldering | Download Verified |
| 33 | Reflow and Wave Soldering methods to attach SMDs | Download Verified |
| 34 | Solders; Wetting of solders; Flux and its properties; Defects in wave soldering | Download Verified |
| 35 | Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures | Download Verified |
| 36 | SMT failure library and Tin Whiskers | Download Verified |
| 37 | Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys | Download Verified |
| 38 | Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues | Download Verified |
| 39 | Thermal Design considerations in systems packaging | Download Verified |
| 40 | Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes | Download Verified |
| 41 | Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging | Download Verified |
| 42 | Chapter-wise summary | Download Verified |
| Sl.No | Language | Book link |
|---|---|---|
| 1 | English | Not Available |
| 2 | Bengali | Not Available |
| 3 | Gujarati | Not Available |
| 4 | Hindi | Not Available |
| 5 | Kannada | Not Available |
| 6 | Malayalam | Not Available |
| 7 | Marathi | Not Available |
| 8 | Tamil | Not Available |
| 9 | Telugu | Not Available |