Chapter 3 : Fabrication of CMOS Integrated Circuits

Table 6 : Comparison of evaporation and sputtering

EVAPORATION	SPUTTERING
low energy atoms	higher energy atoms
high vacuum path few collisions line of sight deposition little gas in film	low vacuum, plasma path many collisions less line of sight deposition gas in film
larger grain size	smaller grain size
fewer grain orientations	many grain orientations
poorer adhesion	better adhesion