Advantages |
High deposition rates, simple, high throughput |
Excellent uniformity, purity |
Highly flexible and can deposit semiconductors, metals, dielectrics |
Uses low temperatures necessary for rear end processing |
Disadvantages |
Poor uniformity, purity is less than LPCVD |
Lower (but reasonable) deposition rates than APCVD |
HIGHLY TOXIC!, Very expensive source material. Environmental disposal costs are high |
Plasma damage typically results |