Most of the inorganic pyroelectrics (including ferroelectrics) are perovskite structured. For a general discussion on pyroelectric materials, you can refer to the review article by Roger Whatmore.*
The most common materials are tabulated below.
Material
Structure
Tc (°C)
Pyroelectric Coefficient
(μC.m-2.K-1)
LiTaO3 single crystal
Hexagonal
665
-230
0.75Pb(Mg1/3-Nb2/3)O3-0.25PbTiO3 (PMN-PT) Ceramic
Perovskite
150
-1300
Ba0.67Sr0.33TiO3 (BST) Ceramic
Perovskite
25
-7000
Triglycine sulphate
(NH2CH2COOH)3H2SO4
Sulphate
49
−280
Polyvinylidene fluoride (PVDF) film
Polymer
80
−27
5.5.5.1 Triglycine Sulphate (TGS)
High pyroelectric coefficient
Fragile and water-soluble, difficult to handle and cannot be used in devices where it would be subjected to either a hard vacuum or high humidity as it tends to decompose
Can be modified to withstand temperatures above Curie point without depoling
Used in thermal imaging cameras
5.5.5.2 Polyvinylidene Fluoride (PVDF)
Poor pyroelectric coefficient
Readily available in large areas of thin film
More stable to heat, vacuum and moisture than TGS, mechanically robust
Low heat conductivity and low permittivity
High loss tangent
Commonly used for burglar alarms
5.5.5.3 Perovskite Ferroelectric Ceramics
Generally robust and insensitive to moisture and vacuum
High pyroelectric coefficient and low loss
Better operation near TC
Strong dependence on composition
As a very approximate guide, for large area applications, low dielectric constant materials such as PVDF are preferred while for small area applications, materials with large dielectric constant such as perovskite oxides are preferred.
*R.W. Whatmore, Pyroelectric devices and materials, Reports and Progress in Physics, Volume 49, Page 1335 (1986).