Module 4 :
Lecture 19 : Overview of Composite Materials
 

 

Electronic Packaging

  • Sandwiched PMCs
  • Wide range of architectures are possible, e.g. ball grid arrays, flip chip assemblies etc.
  • Cracking problems may occur due to CTE mismatch between constituents
  • Engineering issues associated with increasing size and evolving architectures

Biomedical Applications

  • Main issues are biocompatibility and durability
  • Aggressive dental applications - crowns, implants
  • Prosthetic devices for humans
  • artificial limbs
  • artificial bone
  • heart valves

Sports Applications

  • Increasing applications in recent years
  • Most applications take advantage of E/M ratio
  • Emerging applications in golf clubs, tennis rackets, pole vaults
  • Main problem is cost vs. performance